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| TDA7266MA 7W MONO BRIDGE AMPLIFIER s s WIDE SUPPLY VOLTAGE RANGE (3-18V) MINIMUM EXTERNAL COMPONENTS - NO SWR CAPACITOR - NO BOOTSTRAP - NO BOUCHEROT CELLS - INTERNALLY FIXED GAIN TECHNOLOGY BI20II s s s STAND-BY & MUTE FUNCTIONS SHORT CIRCUIT PROTECTION THERMAL OVERLOAD PROTECTION SIP9 ORDERING NUMBER: TDA7266MA DESCRIPTION The TDA7266MA is a mono bridge amplifier specially designed for TV and Portable Radio applications. Figure 1. Block and Application Diagram Pin to pin compatible with: TDA7266S, TDA7266, TDA7266M, TDA7266MA, TDA7266B, TDA7297SA & TDA7297. VCC C1 0.22F IN R1 10k C2 10F S-GND 6 + 470F C5 1 OUT1+ 100nF C6 3 4 + 5 7 ST-BY/ MUTE PW-GND Vref 2 OUT1- D03AU1459_mod June 2003 1/9 TDA7266MA ABSOLUTE MAXIMUM RATINGS Symbol Vs IO Top Tstg, Tj Supply Voltage Output Peak Current (internally limited) Operating Temperature Storage and Junction Temperature Parameter Value 20 2 0 to 70 -40 to 150 Unit V A C C THERMAL DATA Symbol Rth j-case Parameter Thermal Resistance Junction-case Value 9 Unit C/W PIN CONNECTION (Top view) 9 8 7 6 5 4 3 2 1 N.C. N.C. PGND SGND STBY/MUTE IN VCC OUTOUT+ D03AU1460 ELECTRICAL CHARACTERISTCS (VCC = 11V, RL = 8, f = 1KHz, Tamb = 25C unless otherwise specified) Symbol VCC Iq VOS PO THD Parameter Supply Range Total Quiescent Current Output Offset Voltage Output Power Total Harmonic Distortion THD 10% PO = 1W PO = 0.1W to 2W f = 100Hz to 15KHz SVR AMUTE Tw GV Ri Supply Voltage Rejection Mute Attenuation Thermal Threshold Closed Loop Voltage Gain Input Resistance 25 25 f = 100Hz, VR =0.5V 40 60 56 80 150 26 30 27 6.3 7 0.05 0.2 1 Test Condition Min. 3 Typ. 11 50 Max. 18 65 120 Unit V mA mV W % % dB dB C dB K 2/9 TDA7266MA ELECTRICAL CHARACTERISTCS (continued) (VCC = 11V, RL = 8, f = 1KHz, Tamb = 25C unless otherwise specified) Symbol VTMUTE Parameter Mute Threshold Test Condition for VCC > 6.4V; Vo = -30dB for VCC < 6.4V; Vo = -30dB VTST-BY IST-BY eN St-by Threshold St-by Current V6 = GND Total Output Voltage A Curve; f = 20Hzto 20KHz 150 Min. 2.3 VCC/2 -1 0.8 Typ. 2.9 VCC/2 -075 1.3 Max. 4.1 VCC/2 -0.5 1.8 100 Unit V V V A V APPLICATION SUGGESTION STAND-BY AND MUTE FUNCTIONS Figure 2. Microprocessor Driving Signals +VS(V) +18 VIN (mV) VMUTE/ STBY pin 5 4.1 2.9 2.3 1.0 0.75 0.5 Iq (mA) VOUT (V) OFF ST-BY MUTE PLAY MUTE ST-BY OFF D03AU1461 The St-by and mute terminals are tied together and they are connected to the supply line via an external voltage divider. The device is switched-on/off from the supply line and the external capacitor C4 is intended to delay the St-by and mute threshold exceeding, avoiding "Popping" problems. 3/9 TDA7266MA Figure 3. Stand-alone low-cost Application VCC C1 470F OUT1+ C2 100nF C3 0.22F R1 47K IN1 ST-BY/MUTE R2 47K C4 10F 4 3 + 1 15 PW-GND 7 S-GND 6 Vref + 2 OUT1- D03AU1462 Figure 4. Distortion vs Ouput Power THD (%) 10 Vcc = 11 V Rl = 8 ohm 1 Figure 6. Distortion vs. Frequency THD(%) 10 1 Vcc = 11 V Rl = 8 ohm f = 15 KHz Pout = 100mW 0.1 f = 5 KHz 0.1 Pout = 2W f = 1 KHz 0.010 0.1 0.010 1 10 100 1k 10k 20k Pout (W) frequency (Hz) Figure 5. Distortion vs Ouput Power THD(%) 10 Figure 7. Gain vs Frequency Level(dBr) 5.0000 4.0000 Vcc = 11V Rl = 8 ohm Pout = 1W Vcc = 9V Rl= 8 ohm 1 3.0000 2.0000 1.0000 f = 15KHz 0.0 -1.000 0.1 f = 5 KHz -2.000 -3.000 f = 1KHz -4.000 1 10 0.010 0.1 -5.000 10 100 1k 10k 100k Pout (W) frequency (Hz) 4/9 TDA7266MA Figure 8. Output Power vs. Supply Voltage Po (W) Figure 10. Mute & Stand-By Attenuation vs Vpin. 5 A tte n u atio n (d B ) 10 0 -1 0 -2 0 -3 0 -4 0 -5 0 -6 0 -7 0 -8 0 -9 0 -10 0 -11 0 -12 0 10.000 Rl = 8 ohm f = 1kHz d = 10% 6.0000 8.0000 4.0000 d = 1% 2.0000 0.0 2.000 4.000 6.000 Vs (V) 8.000 10.00 12.00 1 1 .5 2 2 .5 3 3.5 4 4 .5 5 V pin.5 (V ) Figure 9. Ptot Dissipation & Efficiency vs. Pout Pd (W) 4 3.5 3 2.5 2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 8 Vcc = 11V Rl = 8ohm f = 1KHz 50 40 30 20 10 0 Pd Figure 11. Quiescent Current vs. Supply Voltage Iq (m A) 70 65 60 55 50 45 40 35 30 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 (%) 80 70 60 Pout(W) Vsupply(V) 5/9 TDA7266MA Figure 12. PC Board Component Layout Figure 13. Evaluation Board Top Layer Layout Figure 14. Evaluation Board Bottom Layer Layout 6/9 TDA7266MA HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150C, it is important the dimensioning of the Heat Sinker RTh (C/W). The parameters that influence the dimensioning are: - Maximum dissipated power for the device (Pdmax) - Max thermal resistance Junction to case (RTh j-c) - Max. ambient temperature Tamb max - Quiescent current Iq (mA) Example: VCC = 11V, Rload = 8ohm, RTh j-c = 9 C/W , Tamb max = 50C Vc c Pdmax = (N channels) * -------------------------- + I q V c c 2 R loa d -------------2 Pdmax = 1 * ( 3 ) + 0.5 = 3.5W 150 - T am b max 150 - 50 (Heat Sinker) R Th c-a = ---------------------------------------- - R T h j-c = --------------------- - 9 = 19.5C /W 3.5 P d max In figure 15 is shown the Power derating curve for the device. Figure 15. Power derating curve 2 10 8 a) 6 Pd (W) (c) 4 (d) 2 (b) (a) b) c) d) Infinite Heatsink 10 C/ W 15 C/ W 20 C/ W 0 0 40 80 Tamb (C) 120 160 7/9 TDA7266MA mm MIN. A a1 B B3 b1 b3 C c1 c2 D d1 e e3 L L1 L2 L3 L4 M N P 17.4 3.2 1 0.15 3.1 3 17.6 0.25 17.85 0.685 0.126 0.039 0.006 14.5 2.54 20.32 0.122 0.118 0.693 0.010 0,702 0.85 3.3 0.43 1.32 21.2 0.571 0.100 0.800 0.5 1.6 0.033 0.130 0.017 0.052 0.835 2.7 TYP. MAX. 7.1 3 23 24.8 0.020 0.063 0.106 MIN. inch TYP. MAX. 0.280 0.118 0.90 0.976 DIM. OUTLINE AND MECHANICAL DATA SIP9 D C L1 N P M L3 c2 d1 L4 L2 a1 1 9 L b1 b3 e3 B B3 SIP9 e 1 c 8/9 A TDA7266MA Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - All Rights Reserved Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 9/9 |
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